Our Pressure Curing Oven is a precision-engineered system designed to control pressure and temperature optimized for specific processes. It is widely applied in lamination molding processes, ranging from touchscreens and small LCD film attachment to the advanced semiconductor component industry.
Focusing on user-centric convenience, uniform temperature control, and top-tier safety, it provides a stable and highly reliable environment for critical manufacturing stages.
For Film Bonding
For Semiconductor
packaging
For Glass Bonding
Enhances product performance by ensuring layer uniformity through the removal of air bubbles between film layers. It is primarily utilized in bonding processes for touch panels and small LCD films.
A high-efficiency system that performs curing and defoaming simultaneously. By applying isotropic pressure using gas while curing epoxy resin, it effectively eliminates internal bubbles and voids.
Designed to achieve material homogenization and densification by applying isotropic pressure under constant temperature. This system is ideal for heat treatment of tempered/paired glass and various laminated glass processes.
Designed with a robust structure in accordance with ASME standards, our equipment has passed domestic industrial and gas safety inspections and holds the Chinese SEL (CSEL) certification for guaranteed safety.
The integrated drive system minimizes particle generation, and protective covers are applied to all rotating parts. Using Stainless Steel (SUS) as the primary material, we ensure both high durability and hygiene.
We have implemented a 100% guide structure to achieve optimal airflow. The system is engineered for maximum efficiency to minimize energy and operational losses.
By selecting O-Ring materials tailored to specific operating temperatures, we have significantly extended their lifespan. The structure is specifically designed to minimize debris and contaminant buildup.
Leveraging 30 years of accumulated expertise, we provide high-integrity piping solutions. We select materials that remain stable under high pressure and design layouts that allow operators to monitor the process flow at a glance.
The control panel features an intuitive interface for easy operation. Its stable and superior performance enhances overall equipment management efficiency.
| Series | Inside diameter (㎜) | Inside depth (㎜) | Equipment Size (㎜ / w*d*h) | Equipment Weight (kg) | Pressure (bar) | Temp (℃) | Material |
|---|---|---|---|---|---|---|---|
| FA3 | 300 | 300 | 1,529.5 x 885 x 1,450 | 800 | 8 / 20 | 80 / 100 | SUS304 / SMCM439 |
| 500 | 1,568 x 1,362 x 2,305 | 900 | |||||
| FA5 | 500 | 500 | 1,672 x 2,471.5 x 2,000 | 1000 | |||
| 1000 | 1,672 x 2,471.5 x 2,600 | 1300 | |||||
| FA6 | 600 | 500 | 1,690 x 1,400 x 2,100 | 1500 | |||
| 1000 | 1,690 x 1,400 x 2,600 | 1800 | |||||
| FA9 | 900 | 1000 | 1,915 x 1,580 x 2,950 | 2500 | |||
| 1500 | 1,915 x 1,580 x 3,230 | 3000 | |||||
| FA12 | 1200 | 1500 | 2,125 x 2,080 x 3,020 | 4000 | |||
| 2000 | 2,125 x 2,080 x 3,520 | 5000 |
| Series | Inside diameter (㎜) | Inside depth (㎜) | Pressure (bar) | Temp (℃) | Material |
|---|---|---|---|---|---|
| HA-6322 | 680 | 350 | 20 | 200 | SUS304 |
| HA-6622 | 630 | ||||
| HA-7622 | 720 | 630 | |||
| HA-7822 | 760 | 800 | |||
| HA-8422 | 800 | 400 |
| Series | Inside diameter (㎜) | Inside depth (㎜) | Pressure (bar) | Temp (℃) | Material |
|---|---|---|---|---|---|
| GA6 | 600 | 600 | 9 / 20 | 150 | SUS304 |
| 100 | |||||
| GA9 | 900 | 1000 | |||
| 1500 | |||||
| GA12 | 1200 | 1200 | |||
| 1500 | |||||
| GA15 | 1500 | 2000 | |||
| 1500 | |||||
| GA20 | 2000 | 2000 | |||
| 3000 |
| Type | Inside diameter | Inside depth | Pressure | Temp (℃) |
|---|---|---|---|---|
| A / B / B" (select) | Ø (calculate) | C (select) | Maximum Value to use (bar) | Maximum Value to use (℃) |
| Type | A / B / B" (select) |
|---|---|
| Inside diameter | Ø (calculate) |
| Inside depth | C (select) |
| Pressure | Maximum Value to use (bar) |
| Temp (℃) | Maximum Value to use (℃) |